Quality & compliance
How the cards are graded, what they are tested against, and which factory documents stand behind them.
Grade is a specification, not a label
Two cards can print the same capacity and the same speed class and still be different products. The gap is in the NAND, in the screening, and in what happens when the power drops mid-write.
| Dimension | Consumer grade | Industrial grade |
|---|---|---|
| NAND used | TLC, good die or downgraded wafer | pSLC or SLC, wide-temperature TLC |
| Program / erase cycles | 3,000 – 10,000 | 20,000 – 30,000 (pSLC) · 100,000+ (SLC) |
| Endurance rating | Rarely published, usually below 10 TBW | 50 TBW and up, 1 TB on high-end parts |
| Operating temperature | 0 – 70 °C | -40 – 85 °C · -45 – 105 °C |
| Screening | Electrical test, light burn-in | Thermal cycling, ageing, wide-temp verification, tightened limits |
| Power-loss behaviour | No protection; retention falls as the card ages | Power-loss protection, on-card ECC and LDPC |
| Health monitoring | Usually none | S.M.A.R.T. and SD Life Monitor |
Rule of thumb: for 24/7 recording, size a card by P/E cycles or TBW, not by capacity. A consumer card used for round-the-clock recording can be exhausted within months.
Qualification tests
Industrial builds are qualified against the same regime before they ship. These are test conditions, not marketing numbers.
| Thermal cycling | -25 °C ↔ 85 °C · ×10 · 30 min |
|---|---|
| High-temperature storage | 85 °C · 500 h |
| Damp heat | 40 °C · 93 % RH · 500 h |
| Shock | 1,500 G · 0.5 ms |
| Vibration | 20 – 2,000 Hz · 20 G · X/Y/Z · 30 min |
| Drop | 1.5 m · ×6 |
| ESD | ±4 kV / ±8 kV |
| Bending / torque | 10 N · 0.1 N·m |
Factory credentials
Cards and modules are built in factories whose quality systems are certified. The CE / RoHS reports below belong to the upstream module factory that produces for us — it is the applicant named on each document — and are reproduced with the trade mark and signatures removed.
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